The present invention relates to a sensor device for detecting radiation signals. To enable high signal integrity and cost efficiency while maintaining the capability of being four-sidedly buttable, the proposed sensor device comprises a sensor array (22) comprising a plurality of detectors (11, 11a-d), a sensor element (14) for converting said received radiation signals (74, 74′) into a plurality of corresponding electric signals, an interposer element (16, 16a-d) extending laterally between a first side (28) and a second side (30), and an integrated circuit element (18, 18a-d). The interposer element (16, 16a-d) comprises a front surface (24) facing said sensor element (14) and a back surface (26) parallel to said front surface (24), wherein a front contact arrangement (36) is provided on said front surface (24) for directing said electric signals to a back contact arrangement (40) provided on said back surface (26). The integrated circuit element faces said back surface (26) and is electrically connected to said back contact arrangement (40).
