A medical device including a medical device metallic substrate component, with perforations therethrough, attached to a medical device polymeric component abutting the thin metallic film component. The medical device also includes a polymeric sleeve covering the perforations and at least a portion of the polymeric component abutting the metallic substrate component. Moreover, the polymeric sleeve intrudes into the perforations and joins the metallic substrate component to the polymeric component. A method for attaching a medical device metallic substrate component to a medical device polymeric component includes forming a plurality of perforations in the medical device metallic substrate component and abutting the medical device polymeric component against the medical device metallic substrate component. Subsequently, a polymeric sleeve is applied over the perforations and at least a portion of the abutted medical device polymeric component. Heat and/or pressure is then applied to the polymer sleeve in a manner that results in the polymer sleeve being joined to the medical device metallic substrate and the portion of the abutted medical device polymeric component and the polymer sleeve flowing into the perforations, thereby attaching the medical device metallic substrate component to the medical device polymeric component.
