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METHOD FOR ASSEMBLING CONDUCTIVE PARTICLES INTO CONDUCTIVE PATHWAYS AND SENSORS THUS FORMED
专利权人:
BUCHANAN Mark;KNAAPILA Matti;HELGESEN Geir;HOEYER Henrik
发明人:
BUCHANAN Mark,KNAAPILA Matti,HELGESEN Geir,HOEYER Henrik
申请号:
US201816029705
公开号:
US2018312392(A1)
申请日:
2018.07.09
申请国别(地区):
美国
年份:
2018
代理人:
摘要:
A sensor is achieved by applying a layer of a mixture that contains polymer and conductive particles over a substrate or first surface, when the mixture has a first viscosity that allows the conductive particles to rearrange within the material. An electric field is applied over the layer, so that a number of the conductive particles are assembled into one or more chain-like conductive pathways with the field and thereafter the viscosity of the layer is changed to a second, higher viscosity, in order to mechanically stabilise the material. The conductivity of the pathway is highly sensitive to the deformations and it can therefore act as deformation sensor. The pathways can be transparent and is thus suited for conductive and resistive touch screens. Other sensors such as strain gauge and vapour sensor can also be achieved.
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