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Thin section fabrication apparatus and method of fabricating thin section
专利权人:
SAKURA FINETEK JAPAN CO.; LTD.
发明人:
Tetsumasa Ito
申请号:
US14376552
公开号:
US09164014B2
申请日:
2013.02.05
申请国别(地区):
US
年份:
2015
代理人:
摘要:
A thin section fabrication apparatus includes an epi-imaging data acquisition unit that performs imaging by radiating epi-illumination and acquires imaging data, a diffusion imaging data acquisition unit that performs imaging by radiating diffusion illumination and acquires imaging data, an exposed shape extraction unit that extracts an exposed shape of an exposure portion of the biological sample which is exposed to a surface of the embedding block, based on the imaging data acquired by the epi-imaging data acquisition unit, an embedded shape extraction unit that extracts an embedded shape of an embedding portion of the biological sample which is embedded in the embedding block, based on the imaging data acquired by the diffusion imaging data acquisition unit, and a control unit that determines ending of the preliminary cutting by comparing the exposed shape extracted by the exposed shape extraction unit and the embedded shape extracted by the embedded shape extraction unit.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/
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tetsumasa ito
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