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Electrospun structures and methods for forming and using same
专利权人:
Darrell Reneker
发明人:
Darrell Reneker,Tao Han,Daniel Smith,Camden Ertley,Joseph W. Reneker
申请号:
US12299830
公开号:
US08574315B2
申请日:
2007.05.09
申请国别(地区):
US
年份:
2013
代理人:
摘要:
The present invention relates to structures that contain one or more fiber and/or nanofiber structures where such structures can be formed on a wide variety of structures or surfaces (e.g., asperities, flat surfaces, angled surface, hierarchical structures, etc.). In one embodiment, the present invention relates to a process for forming one or more fibers, nanofibers or structures made therefrom on a wide variety of structures or surfaces (e.g., asperities, flat surfaces, angled surface, hierarchical structures, etc.). In another embodiment, the present invention relates to a process for forming one or more fibers, nanofibers or structures made therefrom on a wide variety of structures or surfaces (e.g., asperities, flat surfaces, angled surface, hierarchical structures, etc.) where such fibers and/or structures are designed to sequester, carry and/or encapsulate one or more substances. In still another embodiment, the present invention relates to structures that contain one or more fiber and/or nanofiber structures on asperities where the nanofiber and/or fiber structures are designed to sequester, carry and/or encapsulate one or more substances.
来源网站:
中国工程科技知识中心
来源网址:
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