An example system includes an array of capacitive elements, a measurement lead, and a ground plane lead. One or more respective capacitive elements of the array of capacitive elements include a dielectric substrate and a corresponding top conductive layer, with each dielectric substrate configured to be positioned between the top conductive layer and a common ground plane. The measurement lead is coupled to the top conductive layer of each of the one or more respective capacitive elements. The ground plane lead is configured to be coupled to the common ground plane. The capacitive elements are structured such that the capacitive elements have varying respective capacitances, and the capacitive elements are arranged positionally within the array of capacitive elements such that a change in total capacitance is indicative of damage to a particular capacitive element at a particular position within the array of capacitive elements.
