Rohm and Haas Electronic Materials CMP Holdings, Inc.
发明人:
Smith Adam P.,Hendron Jeffrey James,Stack Jeffrey Robert,Miller Jeffrey B.
申请号：
US201615382342
公开号：
US2018169827(A1)
申请日:
2016.12.16
申请国别(地区):
美国
年份:
2018
代理人:
摘要：
The present invention provides methods of making a chemical mechanical planarization (CMP) polishing layer or pad comprising providing an open mold having a surface with a female topography that generates a flat or shaped CMP polishing layer surface and having held in place thereon one or more endpoint detection window pieces; mixing a liquid isocyanate component with a liquid polyol component to form a solvent free reaction mixture; spraying the reaction mixture onto the open mold while the one or more window pieces is held in place, with each window piece at a predefined location, followed by curing the reaction mixture.
