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Improved glue line structure
专利权人:
发明人:
KANG, YU HSUN,康裕勋,康裕勛,LIAO, SHU FEN,廖淑芬,廖淑芬,HOU, JAANG JIUN,侯长俊,侯長俊,WANG, HAO CHEN,王皓正,王皓正,CHEN, RENG SHO,陈人寿,陳人壽
申请号:
TW104218621
公开号:
TWM516858U
申请日:
2015.11.19
申请国别(地区):
TW
年份:
2016
代理人:
摘要:
An improved plastic-cladding filament structure includes a combined arrangement of a base layer, thermosetting polymer glue, and at least one conductive filament. The thermosetting polymer glue is combined with the base layer. The at least one conductive filament is enclosed and housed in the thermosetting polymer glue to allow the conductive filament to be attached to the base layer through heating and setting of the thermosetting polymer glue. By means of the property the thermosetting polymer glue that the thermosetting polymer glue gets set after being heated to a predetermined temperature and melted and shaped and once heated to get set and shaped, further heating does not change the shape, the thermosetting polymer glue that encloses and houses the conductive filament can be set to form any desired shape to facilitate combination thereof with the base layer.一種膠線改良結構,係包括有一基層、一熱固性高分子膠及至少一導電線之組合設計,該熱固性高分子膠係結合於該基層上,而該至少一導電線係包覆於該熱固性高分子膠內,以使該導電線能藉由該熱固性高分子膠之受熱固化後與該基層結合,且透過該熱固性高分子膠具有加熱到一定溫度後能溶化成型,而當受熱固化成型後,即使繼續加熱也無法改變其狀態之特性,讓具有包覆導電線之熱固性高分子膠能固化成任何形體,便於與該基層來進行結合者。10‧‧‧基層20‧‧‧熱固性高分子膠30‧‧‧導電線
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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