Low resistivity joints and manufacturing method thereof for connecting wire

• 收藏
• 分享

专利权人:

发明人:

申请号：

JP2008079436

公开号：

JP5554899B2

申请日:

2008.03.26

申请国别(地区):

JP

年份:

2014

代理人:

摘要：

Method for joining wires using low resistivity joints is provided. More specifically, methods of joining one or more wires having superconductive filaments, such as magnesium diboride filaments, are provided. The wires are joined by a low resistivity joint to form wires of a desired length for applications, such in medical imaging applications.

来源网站：

中国工程科技知识中心

来源网址：

http://www.ckcest.cn/home/