A wire and electrode combination suitable for use with implanted medical devices, and a method for coupling the wire and electrode to achieve a robust electrical connection suitable for use with such medical devices are disclosed. The apparatus employs a wire that is optimized for strength, an electrode optimized for biocompatibility, and a termination sleeve with a closed distal end for coupling the wire to the electrode, while eliminating the potential for galvanic corrosion, enhancing weld quality, and facilitating manufacture of the apparatus. The method involves compressing the sleeve to engage the wire at two locations, where contact between the sleeve and wire at the first location seals the interior of the sleeve, and contact between the sleeve and wire at the second location electrically couples the wire to the sleeve. The sleeve, which is easier to manipulate than the wire, is then spot welded to the electrode.
