John E. Marion, III,Jane P. Bearinger,Thomas S. Wilson,Ward Small, IV,Duncan J. Maitland
申请号：
US15053293
公开号：
US10107270B2
申请日:
2016.02.25
申请国别(地区):
US
年份:
2018
代理人:
摘要：
A resistively heated shape memory polymer device is operated using resistive heating to heat the shape memory polymer device. The resistively heated shape memory polymer device is made by providing a wire that includes a resistive medium. The wire is coated with a first shape memory polymer. The wire is exposed and electrical leads are attached to the wire. In one embodiment the shape memory polymer device is in the form of a clot destruction device. In another embodiment the shape memory polymer device is in the form of a microvalve. In another embodiment the shape memory polymer device is in the form of a micropump. In yet another embodiment the shape memory polymer device is in the form of a thermostat or relay switch.
