INTERBODY SPINAL IMPLANTS WITH MODULAR ADD-ON DEVICES

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专利权人:

William Armstrong;James Duncan;Anthony Melkent

发明人:

James Duncan,Anthony Melkent,William Armstrong

申请号：

US13015165

公开号：

US20120197401A1

申请日:

2011.01.27

申请国别(地区):

US

年份:

2012

代理人:

摘要：

An implant assembly for a spinal column includes at least an interbody element and an add-on element that is removably attachable to the add-on element to form an implant assembly. At least a portion of the add-on element is positionable in a space between vertebrae along with the interbody element to support the vertebrae.

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中国工程科技知识中心

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http://www.ckcest.cn/home/