Eun Je Hyun,Seul Gi Park,Ju Hyung Lee,Won Cheol Jeong
申请号：
US15256549
公开号：
US20170067973A1
申请日:
2016.09.03
申请国别(地区):
US
年份:
2017
代理人:
摘要：
A coil assembly and a magnetic resonance imaging (MRI) apparatus including the same are disclosed. After completion of inspection or repair of the coil assembly, the coil assembly is easily coupled to the Mill apparatus. The coil assembly is configured to interact with a magnetic field generated from a MM apparatus and includes a first case configured to be bendable, a second case configured to be bendable and detachably coupled to the first case, and a printed circuit board substrate disposed between the first case and the second case.
