TIMBRE À MICRO-AIGUILLES ET PROCÉDÉ DE FABRICATION ASSOCIÉ

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专利权人:

SNVIA Co.; Ltd.

发明人:

YANG, Seung Yun,SEONG, Keum Yong

申请号：

EP17837202

公开号：

EP3492074A4

申请日:

2017.07.31

申请国别(地区):

EP

年份:

2020

代理人:

摘要：

In a microneedle patch and a manufacturing method therefor of the present invention, the microneedle patch of the present invention comprises: a patch layer which is a flat surface； and a microneedle disposed on one surface of the patch layer, comprising an air-pocket therein, and formed of a polymer having at least one of swellability and solubility.

来源网站：

中国工程科技知识中心

来源网址：

http://www.ckcest.cn/home/