The present invention relates to a fingerprint sensing device and to a method of manufacturing such a device. The device comprises a substrate with readout circuitry a sensing chip arranged on the substrate. The sensing chip comprising a plurality of sensing elements having a surface defining a sensing plane each sensing element being configured to provide a signal indicative of an electromagnetic coupling between a sensing element and a finger placed on the sensing device bond wires arranged between bond pads located on the sensing chip on the substrate respectively to electrically connect the sensing chip to the readout circuitry. A portion of the bond wire protrudes above the chip and an adhesive is arranged on the sensing chip to covering to cover the chip so that the portion of the bond wire protruding above the chip is embedded in the adhesive. A protective plate is attached to the sensing chip by the adhesive. The protective plate forms an exterior.
