Provided are a packaging structure electronic equipment and a preparation method for the packaging structure. This packaging structure comprises: a substrate (100) a sensing assembly (200) the sensing assembly (200) being arranged on an upper surface of the substrate (100) and being electrically connected to the substrate (100) and a package colloid (300) the package colloid (300) being arranged on the upper surface of the substrate (100) and covering at least part of the sensing assembly (200) wherein the sensing assembly (200) comprises a capacitive sensor (210) and an optical sensor (220) and the package colloid (300) comprises at least part of a light transmitting area (310) arranged corresponding to the optical sensor (220). In this way a capacitive sensor and an optical sensor are packaged in a packaging structure so that the integrated degree of the packaging structure can be improved and packaging space is saved.
