Christopher James Kapusta,Eric Patrick Davis,Jason Harris Karp
申请号：
US14045809
公开号：
US09642566B2
申请日:
2013.10.04
申请国别(地区):
US
年份:
2017
代理人:
摘要：
A flexible embedded sensor array includes a first substrate, an electrically conductive pad disposed on at least a portion of the first substrate, and a plurality of sensors disposed on at least a portion of electrically conductive pads. Further, the flexible embedded sensor array includes an electrically non-conductive adhesive material disposed in proximity to one or more of the plurality of sensors, a second substrate, and an electrical contact disposed between at least a portion of the sensor and at least a portion of the second substrate.
