A pressure-sensitive adhesive tape package is disclosed in which while easiness in applying the adhesive tape is pursued, an effect of saving in resources can be obtained. The pressure-sensitive adhesive tape package according to the present invention 10 accommodates an adhesive tape 14 having a support 18 and an adhesive agent layer 12 provided on one surface of the support 18, and includes a release sheet 16 releasably attached to the adhesive agent layer 12. Moreover, in the pressure-sensitive adhesive tape package 10, the release sheet 16 is bent along a predetermined bending line with the adhesive tape 14, and the adhesive tape 14 is sealed inside of the bent release sheet 16. According to such a configuration, the conventionally existing package separated from the release sheet can be eliminated. Moreover, when the release sheet 16 is opened while the release sheet 16 is released from the adhesive agent layer 12 of the adhesive tape 14, an half of the adhesive agent layer 12 is exposed； accordingly, application to the portion for application is easy.
