The present disclosure involves methods and apparatuses for applying fluids onto an advancing substrate having an unconstrained caliper, Hs. The fluid application apparatus may include a slot die applicator and a substrate carrier, wherein the slot die applicator includes a slot opening, a first lip, and a second lip, the slot opening located between the first lip and the second lip. And the substrate carrier includes a base surface and a pattern element that includes a pattern surface and protrudes outward from the base surface. The substrate carrier is positioned adjacent the slot die applicator to define a minimum distance, Hg, between the pattern surface of the pattern element and the first lip and the second lip that is less than the unconstrained caliper, Hs, of the substrate. Embodiments of apparatuses may be configured to monitor establish maintain and/or change the desired minimum distance, Hg, before and/or during operation.
