Hot melt adhesive
- 专利权人:
- 发明人:
- William L. Bunnelle
- 申请号:
- US14302710
- 公开号:
- US09139755B2
- 申请日:
- 2014.06.12
- 申请国别(地区):
- US
- 年份:
- 2015
- 代理人:
- 摘要:
- A hot melt adhesive material and articles made using the hot melt adhesive to assemble structures in an article. The adhesive material typically is manufactured by blending amorphous polymer with a heterophase polymer having crystallinity into an adhesive composition.
- 来源网站:
- 中国工程科技知识中心