Control panels with antimicrobial copper sheet overlays are disclosed. In some embodiments, the antimicrobial copper used in the copper sheet overlays can be selected from copper or copper alloys containing from about 60 to about 100 wt % copper. In other embodiments, the copper sheet overlays have one or more deflection spots to permit an operator to use the control panel to operate an electronic device. Some embodiments include methods to manufacture the control panels comprising antimicrobial copper sheet overlays. Further embodiments include methods for operating an electronic device using the control panels comprising antimicrobial copper sheet overlays.