The present invention relates to a thin film (301) for a lead (300) for brain applications with at least one section (150) comprising a high conductive metal (10) and a low conductive metal (20), whereby the low conductive metal (20) is a biocompatible metal (20) and has a lower electrical conductivity than the high conductive metal (10) and whereby the high conductive metal (10) is at least partially encapsuled by the low conductive metal (20). Furthermore, the present invention relates to a method of manufacturing a thin film (301) for a lead (300) for brain applications and a deep brain stimulation system (100).
