Lawrence D. Swanson,John M. Edgell,Nick A. Youker,John E. Hansen,David A. Chizek
申请号：
US12878406
公开号：
US08954150B2
申请日:
2010.09.09
申请国别(地区):
US
年份:
2015
代理人:
摘要：
The present subject matter provides apparatus and methods for manufacturing an encasement for a component of an implantable medical device having a main circuit board. The method includes forming an encasement aperture on a lateral side of the encasement. The lateral side of the encasement is adapted to be placed substantially parallel to a surface of the main circuit board. A feedthrough assembly is connected through the encasement aperture. The feedthrough assembly includes at least one terminal conductor at least partially passing through the encasement aperture.
