A layered adhesive construct is provided having a backing layer, a first layer of a hydrocolloid adhesive, and a second layer of a hydrocolloid adhesive, where the first and second layers of hydrocolloid adhesives have different composition, and the second layer of hydrocolloid adhesive is interposed between the first layer of hydrocolloid adhesive and the backing layer. The first adhesive layer is a layer of moldable adhesive paste including hydrocolloids having a Strain Recovery below 45% and the second adhesive layer is a layer of hydrocolloid adhesive having a Strain Recovery above 55%.
