Methods for controlling physical vapor deposition metal film adhesion to substrates and surfaces

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专利权人:

Inc.;Medtronic Minimed

发明人:

SRINIVASAN, Akhil,WANG, Yifei

申请号：

AU2019217883

公开号：

AU2019217883A1

申请日:

2019.02.06

申请国别(地区):

AU

年份:

2020

代理人:

摘要：

A method of depositing of a film on a substrate with controlled adhesion. The method comprises depositing the film including metal, wherein the metal is deposited on the substrate using physical vapor deposition at a pressure that achieves a pre-determined adhesion of the film to the substrate. The pre-determined adhesion allows processing of the film into a device while the film is adhered to the substrate but also allows removal of the device from the substrate.

来源网站：

中国工程科技知识中心

来源网址：

http://www.ckcest.cn/home/