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固体撮像装置
专利权人:
浜松ホトニクス株式会社
发明人:
久嶋 竜次,森 治通,澤田 純一,藤田 一樹,本田 真彦
申请号:
JP2008014030
公开号:
JP5091695B2
申请日:
2008.01.24
申请国别(地区):
JP
年份:
2012
代理人:
摘要:
The present invention relates to a solid-state imaging device, etc., having a structure which enables to obtain an image with higher resolution by correcting pixel data even when any one of row selecting wirings is disconnected. A solid-state imaging device (1) comprises a photodetecting section (10), a signal reading-out section (20), a controlling section (30), and a correction processing section (40). The photodetecting section (10) has M×N pixel portions P 1,1 to P M,N two-dimensionally arrayed in M rows and N columns, and each of the pixel portions P 1,1 to P M,N includes a photodiode which generates charges of an amount corresponding to an incident light intensity and a reading-out switch connected to the photodiode. Charges generated in each of the pixel portions P 1,1 to P M,N are inputted into an integrating circuit S n through a reading-out wiring L O,n . A voltage value outputted from the integrating circuit S n corresponding to the amount of inputted charges is outputted to an output wiring L out through a holding circuit H n . The correction processing section (40) applies correction processing to frame data repeatedly outputted from the signal reading-out section (20), and then outputs the frame data after correction processing.
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中国工程科技知识中心
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