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A method for attaching a porous metal layer to a metal substrate
专利权人:
发明人:
申请号:
EP03253855.5
公开号:
EP1398045B1
申请日:
2003.06.18
申请国别(地区):
EP
年份:
2012
代理人:
摘要:
A method for attaching a porous metal layer to a dense metal substrate, wherein the method is particularly useful in forming orthopedic implants such as femoral knee components or acetabular cups. The method, in one embodiment thereof, comprises providing a structured porous layer providing a dense metal substrate providing a binding mixture applying the binding mixture to the exterior of the substrate placing the porous layer against the substrate such that the binding mixture is disposed there between forming an assembly and heat treating the assembly to metallurgically bond the porous layer to the substrate.The method, in another embodiment thereof, comprisesproviding a metal substrateproviding the porous metal structurecontouring a surface of the porous metal structureplacing the porous structure against the substrate such that the contoured surface of the porous structure is in contact with the subtrate, thereby forming an assembly andheating the assembly to metallugically bond the porous structure and the substrate.
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