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SURFACE TREATMENT METHOD FOR COPPER OR COPPER ALLOY, SURFACE TREATMENT LIQUID FOR STERILIZING COPPER OR COPPER ALLOY, AND STERILIZATION METHOD USING COPPER OR COPPER ALLOY TREATED BY SAID METHOD
专利权人:
NATIONAL INSTITUTE FOR MATERIALS SCIENCE
发明人:
Akiko YAMAMOTO,Keiichiro OISHI,Shinji TANAKA
申请号:
US16627867
公开号:
US20200157688A1
申请日:
2018.05.30
申请国别(地区):
US
年份:
2020
代理人:
摘要:
The present invention provides a surface treatment method that improves antimicrobial activity of copper or a copper alloy and enhances immediate effects of antimicrobial actions on the surface of the copper or the copper alloy. A surface treatment method for copper or a copper alloy according to the present invention comprises preparing a reducing agent solution containing a biological reducing substance, and treating the surface of the copper or the copper alloy with the reducing agent solution. The present invention also provides a surface treatment liquid for sterilizing copper or a copper alloy, in which the surface treatment liquid contains a biological reducing substance. The present invention also provides a sterilization method that comprises bringing copper or a copper alloy treated by the surface treatment method into contact with a surface of an object to sterilize the surface of the object.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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