Dino Bortolin,Ofer Rosenzweig,Christopher R. Jenney,Avi Bilu
申请号：
US15076300
公开号：
US09795796B2
申请日:
2016.03.21
申请国别(地区):
US
年份:
2017
代理人:
摘要：
Disclosed herein is an implantable electronic device. The device has a housing and a header connector assembly coupled to the housing. The header connector assembly has a connector assembly and a header enclosing the connector assembly. The connector assembly has a subassembly including an electrically conductive component at least partially residing within a first material that is provided about the electrically conductive component. The header has a second material that is provided about the connector assembly and the subassembly subsequent to the first material setting up about the electrically conductive component.
