Andrew J. Ries,Mark E. Henschel,Lawrence C. McClure,Mark S. Ricotta,Lejun Wang
申请号：
US13788310
公开号：
US08750961B1
申请日:
2013.03.07
申请国别(地区):
US
年份:
2014
代理人:
摘要：
The present invention provides a packaging technique and apparatus that incorporates a flexible substrate package with a three-axis magnetic sensor for three-axis sensing in an implantable medical device. The apparatus includes three single-axis magnetic sensor integrated circuits (ICs) that are mounted to a substrate and encapsulated with a polymer mold compound. The substrate is excised around each of the sensor ICs to form panels that are folded to align the three single-axis sensors in the x, y and z axis.
