A medical electrical lead is disclosed comprising an electrically-conductive shield adjacent to at least a portion of the lead body. The shield is adapted to dissipate energy when the lead is subjected to an electromagnetic field. The shield may be further coupled to a housing of an implantable medical device to enhance energy dissipation capabilities. In another embodiment, a method comprises receiving electromagnetic energy within a shield coating surrounding a portion of the lead. The energy is then dissipated in a manner that protects tissue surrounding the lead from injury.