PROBLEM TO BE SOLVED: To provide a manufacturing method for an electronic unit capable of enhancing the airtightness of an external resin disposed outside of two resins which doubly coat an electronic component.SOLUTION: The manufacturing method for the electronic unit manufactures the electronic unit using a storage body 49 which has a base plate 55 and lateral walls 56 elected from the edge of the base plate and an electronic component coating body 61 comprising an electronic component 46 coated by a heat-resistant resin 47. The manufacturing method includes: an injecting step of injecting a fluidized resin 48c into the storage body after the storage body is set with its base-plate-side down an electronic component arrangement step, after the injecting step, of soaking the electronic component coating body in the liquidized resin and then disposing the electronic component coating body in the storage body to form a space T1 between the storage body and the electronic component coating body in order to coat at least a part of the outer surface of the heat-resistant resin with the fluidized resin and a resin-solidifying step of solidifying the fluidized resin to form the external resin.COPYRIGHT: (C)2013,JPO&INPIT【課題】電子部品を二重に覆う樹脂のうち外側に配置される外部樹脂の気密性を高めることができる電子ユニットの製造方法を提供する。【解決手段】底板55および底板の外縁から立設する側壁56を有する収容体49と、耐熱樹脂47で覆われた電子部品46からなる電子部品被覆体61と、を用いて電子ユニットを製造する電子ユニットの製造方法であって、収容体を底板が下方となるように配置し、樹脂流動体48cを収容体内に流し込む注入工程と、注入工程の後で、樹脂流動体に電子部品被覆体を漬けるとともに、収容体と電子部品被覆体との間に隙間T1が形成されるように配置することで、耐熱樹脂の外面の少なくとも一部を樹脂流動体で覆う電子部品配置工程と、樹脂流動体を固化させて外部樹脂とする樹脂固化工程と、を備える。【選択図】図8
