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HIGH TEMPERATURE MATERIAL FOR USE IN MEDICAL DEVICES
专利权人:
Ethicon LLC
发明人:
Jacqueline A. Anim
申请号:
US16515392
公开号:
US20200009299A1
申请日:
2019.07.18
申请国别(地区):
US
年份:
2020
代理人:
摘要:
A material for use in a medical device includes a blend of a non-melt polymer such as Polyamideimide, a meltable carrier polymer such as Polyetherketoneketone and lubricants/rheology modifiers such that the final polymer material can be extruded, pelletized and used to injection mold components for the medical device. The ratios of the Polyamideimide, Polyetherketoneketone and the lubricants are selected to provide sufficient lubricity and glass transition temperature to the material to make it appropriate for use in high temperature applications and additive manufacturing processes.
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