A sandwiching machine includes a wafer conveying mechanism including multiple wafer conveyance rows and a pair of spaced apart belts. Each belt is positioned toward respective sides of the mechanism such that the belts are located laterally away from the wafer conveyance rows. A plurality of pusher bars extend laterally between the spaced apart belts and connected for movement therewith. Each pusher bar extends beneath a conveyance path of each wafer conveyance row and includes at least one pusher pin extending upward into the conveyance path. At least one stencil assembly extends over the wafer conveyance paths for depositing material onto wafers traveling along at least one of the wafer conveyance paths, wherein a deposit location of the stencil assembly is laterally spaced from each of the belts.
