An imaging unit includes: an image sensor configured to generate an image signal by receiving light and performing photoelectric conversion and a relay member including a plurality of silicon substrates laminated on a back surface side of the image sensor opposite to a light receiving surface of the image sensor, planar type electronic devices being formed on the silicon substrates, and relay the image sensor and a signal cable that transmits the image signal. The relay member includes a multilayer wiring layer laminated on an outermost surface of the silicon substrate, and the multilayer wiring layer includes, on an outermost surface, a material allowing the signal cable to be connected.
