Shariq Hussain,James P. Williams, JR.,Paul M. Elizondo, II
申请号：
US14203515
公开号：
US20140262919A1
申请日:
2014.03.10
申请国别(地区):
US
年份:
2014
代理人:
摘要：
A blister pack is provided having a wireless identification device located at a predetermined position. A moldable blister web is mounted with wireless identification devices at selected positions corresponding to the size of the blister components to be molded from the web. When a cavity is molded in the web in manufacturing a blister pack, the pre-mounted wireless identification device will be located at a predetermined position in the blister pack. In one embodiment, RFID devices are used as the wireless identification devices. The RFID device is pre-mounted on the blister web so that it will be located at a flat surface of the blister pack or on a rounded surface. The RFID devices are pre-mounted, and then the blister is molded to have a cavity, the product is inserted into the cavity and a sealing package component is attached to the blister cavity to seal it.
