PROBLEM TO BE SOLVED: To combine a semiconductor radiation source suitable for an optical curing device of dentistry technology with a high output, and excellent cooling of an used semiconductor chip with a structure which is small and fits various output stages.SOLUTION: This semiconductor radiation source includes: a base member at least one LED chip thermally connected to an end surface of the base member and a flexible printed circuit mounted on the same end surface of the base member. In the semiconductor radiation source, the flexible printed circuit at least partially surrounds the LED chip, includes at least one printed conductor line (20) electrically connected to the LED chip, and further includes at least a bendy or curved zone (27) where partially extends along with a sidewall section of the base member in a peripheral region of the base member. At least a part of the zone of the flexible printed circuit (14) at least partially penetrates and extends into especially a lateral recess (34) in the base member (12).COPYRIGHT: (C)2010,JPO&INPIT【課題】歯科技術の光硬化装置に適している半導体放射線源を高い出力と使用される半導体チップの良好な冷却を小型かつ多様な出力段階に適合する構造と組み合わせる。【解決手段】基礎部材と前記基礎部材の端面と熱接続された少なくとも1個のLEDチップと前記基礎部材の同じ端面上に装着された柔軟なフレキシブルプリント回路を備え、前記フレキシブルプリント回路が前記LEDチップを少なくとも部分的に包囲するとともに前記LEDチップと電気接続された少なくとも1本の印刷された導体軌道(20)を有し、更に前記フレキシブルプリント回路が前記基礎部材の周囲領域内に少なくとも部分的にその基礎部材の側壁部に沿って延在する曲折あるいは湾曲した区域(27)を有してなる半導体放射線源である。前記フレキシブルプリント回路(14)の区域の少なくとも一部分が基礎部材(12)内の特に側方窪み部(34)内に少なくとも部分的に進入して延在する。【選択図】図1
