An ultrasonic device includes a base in which a base layer of a vibrating film is formed in every opening that is disposed in an array； an interconnect layer, which is a conductor, formed on the base layer； an insulating film that is formed on the interconnect layer, and forms a laminated structure with respect to the base layer； a plurality of piezoelectric elements that are separated from the interconnect layer by the insulating film, the piezoelectric elements each including a first electrode and a second electrode that sandwich a piezoelectric film on the insulating film； and a through conductor that passes through the insulating film, and connects at least one of the first electrode and the second electrode to the conductor constituting the interconnect layer.
