A blister package and method of manufacture are provided, the package including a novel pull tab configuration for opening an individual product compartment of the package. According to one embodiment the blister package includes:a thermoformed plastic base substrate having a thickness, the base substrate having at least one thermoformed recessed product cavity to retain product therein and an associated sealing surface area surrounding the product cavity,a peelable cover layer removably attached to the base substrate comprising a first portion covering the product cavity and a second portion overlapping and sealed to the surrounding sealing surface area,the base substrate having a notched line extending across the sealing surface area between two points on a perimeter of the sealing surface area and spaced from the product cavity, the notched line including alternating severed and unsevered line portions, the severed line portions extending completely through the thickness of the base substrate while the unsevered line portions comprise connected portions；wherein a portion of the base substrate is configured to be bent and broken off by a user at the notched line to form a pull tab that includes the broken off portion of the base substrate and the cover layer sealed thereto, enabling a user grasping the pull tab to peel back and separate the cover layer from the sealing surface area surrounding the product cavity to enable release of a product from the product cavity.
