PROBLEM TO BE SOLVED: To enhance physical strength of connection between an imaging element and a flexible board.SOLUTION: This imaging device includes: the imaging element 58 having an imaging face 58a and an electrical joining part 58b continuously formed beside the imaging face 58a a cover glass 64 disposed on the imaging face 58a of the imaging element 58 an FPC 62 (the flexible wiring board) joined to the electrical joining part 58b of the imaging element 58, and covering the electrical joining part 58b and a plate material 68 covering a part corresponding to the electrical joining part 58b of the imaging element 58 out of the FPC 62 without adhesion. A resin 70 integrally adhesively fixes the cover glass 64, the plate material 68, and an exposure portion of the FPC 62.COPYRIGHT: (C)2012,JPO&INPIT【課題】撮像素子とフレキシブル基板との接続の物理的強度を向上させること。【解決手段】撮像面58aと撮像面58aの側方に連設された電気接合部58bとを有する撮像素子58と、撮像素子58の撮像面58a上に配置されたカバーガラス64と、撮像素子58の電気接合部58bに接合されて電気接合部58bを覆うFPC62(フレキシブル配線基板)と、FPC62のうちで撮像素子58の電気接合部58bに対応した部分を非接着で覆う板材68を備えた。樹脂70は、カバーガラス64と板材68とFPC62の露出部分とを一体にして接着固定する。【選択図】図5
