Michael W. Barror,John K. Day,David A. Ruben,James D. Bradley
申请号：
US16405032
公开号：
US20190255335A1
申请日:
2019.05.07
申请国别(地区):
US
年份:
2019
代理人:
摘要：
Various embodiments of a sealed package and a method of forming the package are disclosed. The package can include a housing extending along a housing axis between a first end and a second end, and an electronic device disposed within the housing that includes a device contact. The package can also include an external contact hermetically sealed to the housing at the first end of the housing, and a conductive member electrically connected to the external contact and the device contact such that the conductive member electrically connects the electronic device to the external contact. The conductive member is compressed between the external contact and the device contact.
