A leveling pad for stabilizing a device is provided. The leveling pad comprises a metal base having a socket configured to receive a portion of the device and a liner coupled to the metal base and being configured to cold flow into a profile of a floor surface when a weight of the device is applied to the leveling pad. The liner may be of a polymer, such as vinyl. The liner is further configured to plastically deform into the profile of the floor surface. The plastic deformation is designed to increase a magnitude of a shear force or a tensile force required to separate the liner from a portion of the floor surface into which it is configured to plastically deform.
