Steven Holmes,Bruce B. Doris,Hariklia Deligianni,Roy R. Yu
申请号：
US15991254
公开号：
US20190366102A1
申请日:
2018.05.29
申请国别(地区):
US
年份:
2019
代理人:
摘要：
Techniques regarding an implantable biosensor package are provided. For example, one or more embodiments described herein can regard an apparatus, which can comprise a biosensor module. The biosensor module can comprise a semiconductor substrate and a processor. The semiconductor substrate can have a sensor operably coupled to the processor. The apparatus can also comprise a polymer layer. The biosensor module can be embedded within the polymer layer such that the polymer layer can be provided on a plurality of sides of the biosensor module.
