A connection made between a contact and a conductor in an implantable lead assembly includes a slot, formed in the contact, and a crimp sleeve, attached to the contact wherein the crimp sleeve includes a contact coupling, which rests within the contact slot, and a conductor coupling, crimped around the conductor, within a body of the lead assembly. The conductor coupling of the crimp sleeve may be pushed through the contact slot, anywhere along a length of the slot, so that the contact coupling comes to rest between opposing edges of the slot. A preferred profile of the contact coupling of the crimp sleeve is such that the contact coupling rests within the contact slot, without falling through to the inside diameter of the contact, prior to attachment thereto.
