Yeo-O Youn,Dong-Sik Park,Jeong-Beom Park,Hye-Sun Song,A-Ram Sohn
申请号：
US14091552
公开号：
US09085717B2
申请日:
2013.11.27
申请国别(地区):
US
年份:
2015
代理人:
摘要：
The present invention provides an adhesive layer for an electrical connection. The adhesive layer includes a base resin an ionic optical-curing agent an optical curing accelerant and a conductive particle having a size of several to several tens nanometers, wherein the adhesive layer is cured by a UV light, and the UV light is diffused by the optical curing accelerant.
