The present disclosure relates to methods for bonding first and second substrates together with tackifier free adhesives. The tackifier free adhesive may be applied to the second substrate to define an adherence zone. The first substrate is positioned on the adherence zone of the second substrate to define a first region and a second region of the adherence zone. In the first region, the tackifier free adhesive is positioned between the first substrate and the second substrate. In the second region, the tackifier free adhesive may or may not be positioned between the first substrate and the second substrate, and may not bond the first substrate with the second substrate. Thus, tackifier free adhesive may be applied to the second substrate to create an adherence zone defining a relatively large area that permits the placement of the first substrate thereon without the need to completely cover the adherence zone.
