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Collagen Sponge
专利权人:
发明人:
Ken NAKATA,Yukihiro SATO,Daisuke IKEDA,Ichiro FUJIMOTO
申请号:
US14767601
公开号:
US20160089474A1
申请日:
2014.02.14
申请国别(地区):
US
年份:
2016
代理人:
摘要:
Provided is a collagen sponge which has compressive strength (stress) equivalent to that of a tissue into which the collagen sponge is to be implanted, has no unevenness in structure and stress, and has a pore structure for allowing cells to infiltrate thereinto. The collagen sponge is obtained by subjecting a collagen dispersion, a collagen solution, or a mixture thereof having a collagen concentration of 50 mg/ml or more to freeze-drying and insolubilization treatment thereafter. The collagen sponge thus obtained has a stress of from 10 kPa to 30 kPa when loaded with 10% strain, has in its surface and inside a pore structure having a mean pore diameter ranging from 50 μm to 400 μm, and has a pore diameter standard deviation equal to or less than 80% of the mean pore diameter.
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