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Hermetically-sealed package and method of forming same
专利权人:
Medtronic; Inc.
发明人:
Mark R Boone,Jonathan L Kuhn
申请号:
US15477904
公开号:
US10463285B2
申请日:
2017.04.03
申请国别(地区):
US
年份:
2019
代理人:
摘要:
Various embodiments of a sealed package and a method of forming such package are disclosed. The package includes a housing, a substrate hermetically sealed to the housing, and a light source disposed on a first major surface of the substrate. The package further includes a detector disposed on the first major surface of the substrate and having a detecting surface. The package also includes a masking layer disposed on at least one of the first major surface and a second major surface of the substrate, where the masking layer includes a first aperture aligned with an emission axis of the light source in a direction orthogonal to the first major surface of the substrate. The masking layer further includes a second aperture aligned with a detection axis of the detector in a direction orthogonal to the first major surface of the substrate.
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