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Non-contact fungicide composition
专利权人:
花王株式会社
发明人:
藤井 志子,石川 晃,阿部 秀幸
申请号:
JP2008129559
公开号:
JP5185689B2
申请日:
2008.05.16
申请国别(地区):
JP
年份:
2013
代理人:
摘要:
<;P>;PROBLEM TO BE SOLVED: To provide a non-contact type mildew-proofing agent composition which can continuously exhibit excellent mildew-proofing performance for a long period without being in direct contact with a material to be proofed against mildew. <;P>;SOLUTION: The non-contact type mildew-proofing agent composition comprises a component (a) which is at least one kind selected from the compounds represented by formula (1) (wherein X is -OH, -R<;SP>;1<;/SP>;or -OR<;SP>;2<;/SP>;; R<;SP>;1<;/SP>;is a 1-22C hydrocarbon group; -OR<;SP>;2<;/SP>;is a 6-15C residue of an alcohol having a boiling point of 150-280°;C and a log P value of 1-4; Y is X or -OSi(X)<;SB>;3<;/SB>;; n is a number of 0-15 showing an average value; and a plurality of X and Y may be the same or different, respectively but X and Y have at least one -OR<;SP>;2<;/SP>;in the molecule) and a mildew-proofing agent composition package is obtained by housing this non-contact type mildew-proofing agent composition in an container. <;P>;COPYRIGHT: (C)2010,JPO&INPIT
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