An implant fixture of the present invention comprises an upper and lower dual hybrid outer surface treated by: blasting alumina, titanium oxide, calcium oxide and the like at a high pressure at an outer lower portion of the fixture so as to have a surface roughness of 1.5-3.0 μm dipping the entire outer surface of the fixture of which the lower portion was blasted, into an etchant comprising hydrochloric acid, sulfuric acid, and water so as to have a surface roughness of 0.2-1.0 μm, thereby allowing a surface upper section (Ua) to have a surface roughness of 0.2-1.0 μm from the upper end of the fixture to a downward position of 2.5 mm and allowing a lower section (La) below the upper section (Ua) of the fixture to have a surface roughness of 1.5-3.0 μm by blasting and a surface roughness of 0.2-1.0 μm by etching.
